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October 2006

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Subject:
From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:
Thu, 5 Oct 2006 13:51:19 -0500
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Are you talking only the ICT bottomside bed of nails fixtures? Then look
at the wave solder flux.
Are you talking about flying probe? Then look at the paste flux.
Are you talking false fails from physically smaller solder joints?
The lead-free solder joints should not be causing any difference in the
probe-ability, unless you are really seeing open solder joints that are
being closed by the probing action.
However, the no-clean flux residues from your Pb-free wave solder
process and reflow process are now probably being "baked on" a little
harder than they were with the no-clean fluxes from your 63/37 process,
as the process temperatures are higher. Thus you get more false fails
because the test pins have a tougher time breaking through the flux
coating.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joel Alexander
Sent: Thursday, October 05, 2006 1:15 PM
To: [log in to unmask]
Subject: [TN] Lead free ICT testing problems

We are seeing intermittent false failures on lead free assemblies. We
would have these occasionally with leaded solder but it has
significantly increased with lead free. We are using SN100C in our wave
solder and Superior 420-S no clean flux.  Are there any types of probe
pins that can produce better yields with lead free solder.



Joel Alexander

APSCO Quality Assurance Manager

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