I am going to take a crack at it.  After reviewing the two
sections it seems that a cracking of the solder mask is consider a worse
defect than a blister or complete absence of solder mask as long it does
not bridge two conductors. I wonder if it is because, cracking may
indicate poor solder mask that,  with time, may flake off. A blister may
indicate poor cleaning ( bad adhesion ) in an area. Now lets wait for
the big guns opinions.
        Ramon

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Kevin Glidden
Sent: Wednesday, October 04, 2006 11:17 AM
To: [log in to unmask]
Subject: [TN] IPC-610D Question

Question on IPC-A-610D, open for interpretation I guess...

Per Section 10.5.1.1: Cracking of Solder Resisit = Defect, Class 3

Per Section 10.5.1.2: Blisters / flaking exposes bare copper = Process
Indicator, Class 3

Huh????

So if I have cracks in the solder mask (but still adhered) over the PCB
laminate (not between conductors or over conductors), it's scrap, but if
I have soldermask which is completely gone and exposes copper of a trace
or pad, it is a "Process Indicator"?

Opinions?

Thanks,
Kevin Glidden
Manufacturing Engineer
Astronics Luminescent Systems Inc.

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e To
unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or
(re-start) delivery of Technet send e-mail to [log in to unmask]: SET
Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the
posts: send e-mail to [log in to unmask]: SET Technet Digest Search the
archives of previous posts at: http://listserv.ipc.org/archives Please
visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for
additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------