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October 2006

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Subject:
From:
Nimal Liyanage <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Nimal Liyanage <[log in to unmask]>
Date:
Wed, 4 Oct 2006 06:11:41 -0700
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Hi Dennis:

  Yes, we have done some studies on this subject. Copper dissolves faster from the surface and thru holes due to higher process temps and solubility rates in tin rich alloys.
  You could find some data in a paper we published in the Feb. issue of the Circuitree magazine.

  Please contact me if you need further info.

  Nimal



Nimal Liyanage,Ph.D.
Director of Business Development
Metallic Resources Inc.
27 Shearwater Place, Newport Beach, CA 92660
949 854 7898
949 854 7175 fax
949 697 5826 mobile







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