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October 2006

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Subject:
Re: Board Warp and Resultant Reliability
From:
Leland Woodall <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Leland Woodall <[log in to unmask]>
Date:
Tue, 3 Oct 2006 23:10:37 -0400
Content-Type:
text/plain
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text/plain (49 lines) 
Werner,
 
I was hoping you'd respond.  Your statement reflects what I'd initially thought, but I wanted to hear your personal opinion.  Thank you so much for assisting those of us who haven't had your experience in reliability testing, including myself.
 
Have a great week, and as always, your expertise is sincerely appreciated...
 
Leland

________________________________

From: TechNet on behalf of Werner Engelmaier
Sent: Tue 10/3/2006 6:11 PM
To: [log in to unmask]
Subject: Re: [TN] Board Warp and Resultant Reliability



Hi Leland,
To my knowledge, the bow and twist specs set forth in IPC-A-610D stating that
after solder
conditions should not exceed 0.75% for surface mount applications has nothing
to do with reliability, but more with manufacturing issues. 



Werner

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