We are primarily a military OEM and have specified Plasma Etch back of
0.0002 to 0.003".  This was to support (the now defunct) Mil 5510.  We
have had little or no problems with this requirement.
Fast forward:  Our new CEM says that this is old technology and that
their suppliers no longer have the equipment to do plasma etch back.
They do not specify what they want to use for a desmear process.   This
is a MAJOR CEM house so I am hesitant to tell them to "stuff it".  (Pun
intended:  It IS Friday) 
So, the question:  What is the industry standard for hi-rel/military
class 3 PCB's now?  And is Plasma Etchback dead?  I am very confused, as
I thought the trend was to MORE Plasma etchback, not less.


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