I suppose that if the lead coating was gold over palladium this same source
would make a similar recommendation consistent with the melting points of
these elements.

Best regards

Lee

J. Lee Parker, Ph.D.
JLP Consultants LLC
804 779 3389

----- Original Message -----
From: "Richard Kraszewski" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Thursday, October 26, 2006 1:17 AM
Subject: [TN] Backward Compatibility of Tin Electroplating


Does anyone have any reason to suspect that tin electroplated SM
components being soldered with a 63/37 solder paste require a profile
that must exceed the reflow temperature of tin?

Being told by a component vendor this is the case.  I would totally
discount this but seem to recall reading this more than once on some
other component Tech data sheets. I can't explain why this would be
necessary, but.....

Any thoughts would be appreciated.

Rich K / Kimball


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