I greatly appreicate you sharing your thoughts on this matter. I especially like the welding comparison. 
 
I'm convinced that this supplier is stretching for any explanation and merely blowing smoke.
 
Thanks again. 
 
Rich K

________________________________

From: TechNet on behalf of Werner Engelmaier
Sent: Thu 10/26/2006 1:27 PM
To: [log in to unmask]
Subject: Re: [TN] Backward Compatibility of Tin Electroplating



Hi Rich,
For soldering, in stark contrast with welding, the joints are made   by the
dissolution of the the base metal without melting it, by being in intimate
contact with the liquid solder. Thus, all that is required is that the temperature
be slightly above the Liquidus of the solder [183C for eutectic Sn/Pb, 217C
for eutectic SnAg Cu]. Thus, when you are soldering to tin plating, you do not
reach 232C.

Werner

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