Hi Rich! Unless the electroplated tin has some unique surface finish
characteristics, it is not necessary to exceed 232C (the melting point of
tin) in the reflow process. Some folks don't realize that the majority of
solder connections are the result of molten solder alloys diffusing into
component or pwb surface finishes rather than both surfaces being molten.
An example I like to use is that if we needed to "melt" a gold surface
finish (which some component fabricators use as their solderable finish)
then we would need to achieve a reflow profile exceeding 1064C which would
be a bit of an issue for the rest of the assembly! Could the vendor be
suggesting that 232C needs to be exceeded for some other reason than
creating the solder joint?
Dave Hillman
Rockwell Collins
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Richard
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[TN] Backward Compatibility of Tin
10/26/2006 12:17 Electroplating
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Richard
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Does anyone have any reason to suspect that tin electroplated SM
components being soldered with a 63/37 solder paste require a profile
that must exceed the reflow temperature of tin?
Being told by a component vendor this is the case. I would totally
discount this but seem to recall reading this more than once on some
other component Tech data sheets. I can't explain why this would be
necessary, but.....
Any thoughts would be appreciated.
Rich K / Kimball
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