Hello Rich,

The component vendor does not seem to understand the soldering process.
You need to reflow to suit the solder paste not the metal being soldered
to.

regards,
Phil.


-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Richard Kraszewski
Sent: Thursday, 26 October 2006 2:47 PM
To: [log in to unmask]
Subject: [TN] Backward Compatibility of Tin Electroplating


Does anyone have any reason to suspect that tin electroplated SM
components being soldered with a 63/37 solder paste require a profile
that must exceed the reflow temperature of tin?

Being told by a component vendor this is the case.  I would totally
discount this but seem to recall reading this more than once on some
other component Tech data sheets. I can't explain why this would be
necessary, but.....

Any thoughts would be appreciated. 

Rich K / Kimball
  

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