Does anyone have any reason to suspect that tin electroplated SM
components being soldered with a 63/37 solder paste require a profile
that must exceed the reflow temperature of tin?

Being told by a component vendor this is the case.  I would totally
discount this but seem to recall reading this more than once on some
other component Tech data sheets. I can't explain why this would be
necessary, but.....

Any thoughts would be appreciated. 

Rich K / Kimball
  

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