Folks,
 
Many moons ago (circa1985) I attended a seminar on SMD land pattern design where the speaker said (as he gazed into his crystal ball) that round pads could potentially become the pad of choice for 2 pin SMD's. If I remember right he said that some of the benefits of round pads were better solderability, less tombstoning and more room to route traces. He added that this was a hot subject in Japan at the time.
 
Since then I havn't seen any boards with round pads for discrete SMD's which makes me wonder. Is anybody using round pads for SMD devices? Has anybody ever heard of doing this and know any reasons why it didn't work?
 
The reason this came up is that round pads would be beneficial when placing bypass caps and terminators between the via fan-out pattern of a BGA.
 
Thanks Much!
 
Regards,
Rick
 

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