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October 2006

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Subject:
From:
Ian Hanna <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ian Hanna <[log in to unmask]>
Date:
Fri, 20 Oct 2006 08:45:59 -0400
Content-Type:
text/plain
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text/plain (86 lines)
Assuming you're not assembling at sea -- the finish will have
disappeared into your solder joint long before your ship sails.
Question is do you prefer a copper/solder or a nickel/solder bond.  Ian

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Charlie McMahon
Sent: Friday, October 20, 2006 7:28 AM
To: [log in to unmask]
Subject: Re: [TN] Gold immersion vs. silver immersion

Good Morning All:



Might I ask for some guidance from you all..



In determining a surface coating a conflict has arisen between choosing
Gold
immersion vs. Silver immersion as the

choice. The application is for boards that are used in shipboard
electronics
(non military) but they are protected from the external environment.



My question is which is the more appropriate coating?

Technically, the gold has always worked from the PCB fab and assembly
end
with success with a controlled cost of ownership.

The silver however is one that causes concern.



Any suggestions would be appreciated.



Best Regards,



Charlie McMahon

McMahon Sales Company










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