TECHNET Archives

October 2006

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
- Bogert <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, - Bogert <[log in to unmask]>
Date:
Thu, 19 Oct 2006 18:49:21 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (18 lines)
October 19, 2006

It is known that tin-whiskers grow from compressive stress such as may be introduced during tin plating from the traditional tin plating baths.

My question is, can tin whiskers form from pure tin plating that is deposited by a brush tin plating process (AMS 2451, AMS 2451/12)?  Is there any available test data or other data that supports this (I have plenty of info on growing tin-whiskers on other than brush plating)?  

If tin whiskers can grow on brush tin plating, will the tin whisker mitigation methods in IPC/JEDEC JP002 mitigate the potential for growing 
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
tin-whiskers?

ATOM RSS1 RSS2