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October 2006

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Subject:
From:
Lee parker <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Lee parker <[log in to unmask]>
Date:
Wed, 18 Oct 2006 16:22:44 -0400
Content-Type:
text/plain
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text/plain (131 lines)
This could very likely be Flash Gold which is electroplated gold and nickel.
If this is the case, all of the outer traces will be plated with soft gold
over nickel; the soldermask will rest on the gold coating. You may want to
have the supplier's local rep have cross sections made of the traces at a
lab of your choosing.

Best regards

Lee

J. Lee Parker, Ph.D.
JLP Consultants LLC
804 779 3389




----- Original Message -----
From: "Hfjord" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, October 18, 2006 11:58 AM
Subject: Re: [TN] ENIG problem


> Not one single count of Cobalt.
> Inge
>
>
> ----- Original Message -----
> From: "R Sedlak" <[log in to unmask]>
> To: <[log in to unmask]>
> Sent: Wednesday, October 18, 2006 1:09 AM
> Subject: Re: [TN] ENIG problem
>
>
> > Ingemar:
> >
> > I have a suspicion you may have found the answer...
> > Thick gold can only mean electroplated gold... electroplated gold is
> > often
> > alloyed (think Cobalt is most common alloying metal)... which
> > undoubtedly
> > would make bonding difficult.... remember, in electroplating gold, pure
> > gold is often referred to as "soft gold".... the alloying metals are
> > present to harden the gold... which has to interfere with bonding...
> >
> > And from the comments about appearance, it may well not be well alloyed.
> >
> > Rudy Sedlak
> > RD Chemical Company
> >
> > "Ingemar Hernefjord (KC/EMW)" <[log in to unmask]> wrote:
> > Hi amigos,
> > I should never said that we had no ENIG problems. Now we seem to have
> > one. Chinese board supplier. Problems with heavy wire aluminum bonding
> > on the ENIG pads. Too low pull test values. Possible reason: pad surface
> > invaded by copper particles after the bake/reflow/mounting. Sending
> > picture to Mr Yoda. Never seen this before. Gold is too thick for being
> > ENIG (>1um), Nickel about 6um. Can't see how Copper could diffuse to the
> > surface so rapidly and at those low temperatures which are typical for a
> > general assembly process. Any clue? Graham? You seem to be sitting at
> > the keyboard just now.
> > Ingemar Hernefjord
> > SAAB MICROWAVE SYSTEMS
> >
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