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October 2006

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Subject:
Re: ENIG problem
From:
Hfjord <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Hfjord <[log in to unmask]>
Date:
Wed, 18 Oct 2006 22:16:59 +0200
Content-Type:
text/plain
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text/plain (106 lines) 
I already have a hangover...
will check what you say.
Inge

----- Original Message -----
From: "Jeffrey Bush" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, October 18, 2006 5:57 PM
Subject: Re: [TN] ENIG problem


A microsection of a land may provide evidence of ED is not.  Since ED is
used for etch resist, you should have the NI/AU overhang specific to the
surface, where the ENIG will coat the surface and edges uniformly.

Jeffrey Bush
Director, Quality Assurance and Technical Support
VERMONT CIRCUITS INCORPORATED
           76 Technology Drive - POB 1890
              Brattleboro, Vermont 05302
                Voice - 802.257.4571 ext 21
                    Fax - 802.257.0011
                       <http://www.vtcircuits.com/>


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Hfjord
Sent: Wednesday, October 18, 2006 11:55 AM
To: [log in to unmask]
Subject: Re: [TN] ENIG problem

The chinese company witholds this is ENIG.
Inge
----- Original Message -----
From: "Werner Engelmaier" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, October 17, 2006 11:05 PM
Subject: Re: [TN] ENIG problem


Hi All,
I doubt very much this is ENIG-they must have simply substituted ED Au
for
the iAu-that is what happened in my situation.

Werner

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