Not one single count of Cobalt.
Inge


----- Original Message -----
From: "R Sedlak" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, October 18, 2006 1:09 AM
Subject: Re: [TN] ENIG problem


> Ingemar:
>
> I have a suspicion you may have found the answer...
> Thick gold can only mean electroplated gold... electroplated gold is often
> alloyed (think Cobalt is most common alloying metal)... which undoubtedly
> would make bonding difficult.... remember, in electroplating gold, pure
> gold is often referred to as "soft gold".... the alloying metals are
> present to harden the gold... which has to interfere with bonding...
>
> And from the comments about appearance, it may well not be well alloyed.
>
> Rudy Sedlak
> RD Chemical Company
>
> "Ingemar Hernefjord (KC/EMW)" <[log in to unmask]> wrote:
> Hi amigos,
> I should never said that we had no ENIG problems. Now we seem to have
> one. Chinese board supplier. Problems with heavy wire aluminum bonding
> on the ENIG pads. Too low pull test values. Possible reason: pad surface
> invaded by copper particles after the bake/reflow/mounting. Sending
> picture to Mr Yoda. Never seen this before. Gold is too thick for being
> ENIG (>1um), Nickel about 6um. Can't see how Copper could diffuse to the
> surface so rapidly and at those low temperatures which are typical for a
> general assembly process. Any clue? Graham? You seem to be sitting at
> the keyboard just now.
> Ingemar Hernefjord
> SAAB MICROWAVE SYSTEMS
>
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