OK, I know you guys are probably going to shake your head on this one, but
I have to ask. We have a double sided fine pitch SMT assembly and we
decided to go to white tin for the pad material. Here's where the problem
comes in, we ran one side and when we started process the other side we
found counterfeit chips. We stopped production for two weeks until the
correct parts came in. When we tried to run the boards again, the PCB's
oxidized so badly over the two weeks that we can not get the solder to
wet. Any suggestions, other than scrapping the 170 assemblies at $600 a
piece?

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