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Subject:	Re: ENIG problem
From:	R Sedlak <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, R Sedlak <[log in to unmask]>
Date:	Tue, 17 Oct 2006 16:09:08 -0700
Content-Type:	text/plain
Parts/Attachments:	text/plain (49 lines)

Ingemar:

I have a suspicion you may have found the answer...
Thick gold can only mean electroplated gold... electroplated gold is often alloyed (think Cobalt is most common alloying metal)... which undoubtedly would make bonding difficult.... remember, in electroplating gold, pure gold is often referred to as "soft gold".... the alloying metals are present to harden the gold... which has to interfere with bonding...

And from the comments about appearance, it may well not be well alloyed.

Rudy Sedlak
RD Chemical Company

"Ingemar Hernefjord (KC/EMW)" <[log in to unmask]> wrote:
Hi amigos,
I should never said that we had no ENIG problems. Now we seem to have
one. Chinese board supplier. Problems with heavy wire aluminum bonding
on the ENIG pads. Too low pull test values. Possible reason: pad surface
invaded by copper particles after the bake/reflow/mounting. Sending
picture to Mr Yoda. Never seen this before. Gold is too thick for being
ENIG (>1um), Nickel about 6um. Can't see how Copper could diffuse to the
surface so rapidly and at those low temperatures which are typical for a
general assembly process. Any clue? Graham? You seem to be sitting at
the keyboard just now.
Ingemar Hernefjord
SAAB MICROWAVE SYSTEMS

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