Guys,

What is Steve on about? that photo looks like the Steve we know and love
doesn't it?

Maybe it's just the touch of grey in the hair he is referring to?

John...................8-)

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory
Sent: Tuesday, October 17, 2006 2:17 PM
To: [log in to unmask]
Subject: Re: [TN] ENIG problem

What change? I don't feel any different...I'm still the same ol' Steve.

But something does seem a little askew in that picture you sent of me
Inge. Where in bejesus did you get that photo? (GRIN)

http://stevezeva.homestead.com/files/Steve_copy.jpg

-Steve-


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Hfjord
Sent: Tuesday, October 17, 2006 3:14 PM
To: [log in to unmask]
Subject: Re: [TN] ENIG problem

Thank you, Graham.
By the way, have you seen how Steve Gregory has changed slightly the
last time?
Just wondering if that is genetic or  what.
Maybe, I say again , maybe Steve will show a pic on himself. He writes
as usual, talks as usual, but...but...
Wait and see.
Inge


----- Original Message -----
From: "Graham Collins" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, October 17, 2006 9:18 PM
Subject: Re: [TN] ENIG problem


> Hi Inge
> 900 members, but some (like me) are sitting here scratching our heads
> and thanking whomever we thank that we don't do wire bonding...
> frankly, your problem is interesting but I've got no idea what could
> be going on there.
>
> So I will sit back and say "go Inge!!!"
>
> - Graham Collins
>
>>>> [log in to unmask] 10/17/06 04:01PM >>>
> Wattachallenge!
> Crowds? Hmmm....puter says TN got about 900 members, but where are
all?
> In
> reality, the 'crowd' seems to be maximum a handful or two. Yoda's
> little tribe, so as to say. The Yodaneers....he-he Inge
>
>
> ----- Original Message -----
> From: "John Burke" <[log in to unmask]>
> To: "'TechNet E-Mail Forum'" <[log in to unmask]>; "'Inge'"
> <[log in to unmask]>
> Sent: Tuesday, October 17, 2006 8:02 PM
> Subject: RE: [TN] ENIG problem
>
>
>> And I hear the crowds shouting:
>>
>> "If anyone can section that Inge can".......................8-)
>>
>> Kind regards,
>>
>> John
>>
>> -----Original Message-----
>> From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge
>> Sent: Monday, October 16, 2006 10:55 AM
>> To: [log in to unmask]
>> Subject: Re: [TN] ENIG problem
>>
>> We will try to make a cross section. Maybe hard, because the
> particles are
>> VERY small.
>> Inge
>>
>> ----- Original Message -----
>> From: "Vladimir Igoshev" <[log in to unmask]>
>> To: <[log in to unmask]>
>> Sent: Tuesday, October 17, 2006 4:39 PM
>> Subject: Re: [TN] ENIG problem
>>
>>
>> Hi Inge,
>>
>> The surface looks awfully contaminated. Did you refer to those
> "grayish"
>> spot as "copper particles"? Do you happen to have a cross-sectioned
>> image of the plating?
>>
>> Regards,
>>
>> Vladimir
>>
>> ATI Inc.
>> -----Original Message-----
>> From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory
>> Sent: Tuesday, October 17, 2006 10:32 AM
>> To: [log in to unmask]
>> Subject: Re: [TN] ENIG problem
>>
>> Mornin' Inge and Everybody!
>>
>> Got your picture up, it's here:
>> http://stevezeva.homestead.com/files/ENIGpads.jpg
>>
>> Again another remarkable picture. Just curious about what is at the
> top
>> near the center and also on the right-hand edge? Looks like
> something
>> poking up and growing through the plating...what is that?
>>
>> -Steve Gregory-
>>
>> -----Original Message-----
>> From: TechNet [mailto:[log in to unmask]] On Behalf Of Ingemar
> Hernefjord
>> (KC/EMW)
>> Sent: Tuesday, October 17, 2006 9:05 AM
>> To: [log in to unmask]
>> Subject: [TN] ENIG problem
>>
>>
>> Hi amigos,
>> I should never said that we had no ENIG problems. Now we seem to
> have
>> one. Chinese board supplier. Problems with heavy wire aluminum
> bonding
>> on the ENIG pads. Too low pull test values. Possible reason: pad
> surface
>> invaded by copper particles after the bake/reflow/mounting. Sending
>> picture to Mr Yoda. Never seen this before. Gold is too thick for
> being
>> ENIG (>1um), Nickel about 6um. Can't see how Copper could diffuse to
> the
>> surface so rapidly and at those low temperatures which are typical
> for a
>> general assembly process. Any clue? Graham? You seem to be sitting
> at
>> the keyboard just now.
>> Ingemar Hernefjord
>> SAAB MICROWAVE SYSTEMS
>>
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