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October 2006

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Subject:
From:
Steve Gregory <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Steve Gregory <[log in to unmask]>
Date:
Tue, 17 Oct 2006 16:16:40 -0500
Content-Type:
text/plain
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text/plain (288 lines)
What change? I don't feel any different...I'm still the same ol' Steve.

But something does seem a little askew in that picture you sent of me
Inge. Where in bejesus did you get that photo? (GRIN)

http://stevezeva.homestead.com/files/Steve_copy.jpg

-Steve-


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Hfjord
Sent: Tuesday, October 17, 2006 3:14 PM
To: [log in to unmask]
Subject: Re: [TN] ENIG problem

Thank you, Graham.
By the way, have you seen how Steve Gregory has changed slightly the
last time?
Just wondering if that is genetic or  what.
Maybe, I say again , maybe Steve will show a pic on himself. He writes
as usual, talks as usual, but...but...
Wait and see.
Inge


----- Original Message -----
From: "Graham Collins" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, October 17, 2006 9:18 PM
Subject: Re: [TN] ENIG problem


> Hi Inge
> 900 members, but some (like me) are sitting here scratching our heads 
> and thanking whomever we thank that we don't do wire bonding...
> frankly, your problem is interesting but I've got no idea what could 
> be going on there.
>
> So I will sit back and say "go Inge!!!"
>
> - Graham Collins
>
>>>> [log in to unmask] 10/17/06 04:01PM >>>
> Wattachallenge!
> Crowds? Hmmm....puter says TN got about 900 members, but where are
all?
> In
> reality, the 'crowd' seems to be maximum a handful or two. Yoda's 
> little tribe, so as to say. The Yodaneers....he-he Inge
>
>
> ----- Original Message -----
> From: "John Burke" <[log in to unmask]>
> To: "'TechNet E-Mail Forum'" <[log in to unmask]>; "'Inge'"
> <[log in to unmask]>
> Sent: Tuesday, October 17, 2006 8:02 PM
> Subject: RE: [TN] ENIG problem
>
>
>> And I hear the crowds shouting:
>>
>> "If anyone can section that Inge can".......................8-)
>>
>> Kind regards,
>>
>> John
>>
>> -----Original Message-----
>> From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge
>> Sent: Monday, October 16, 2006 10:55 AM
>> To: [log in to unmask]
>> Subject: Re: [TN] ENIG problem
>>
>> We will try to make a cross section. Maybe hard, because the
> particles are
>> VERY small.
>> Inge
>>
>> ----- Original Message -----
>> From: "Vladimir Igoshev" <[log in to unmask]>
>> To: <[log in to unmask]>
>> Sent: Tuesday, October 17, 2006 4:39 PM
>> Subject: Re: [TN] ENIG problem
>>
>>
>> Hi Inge,
>>
>> The surface looks awfully contaminated. Did you refer to those
> "grayish"
>> spot as "copper particles"? Do you happen to have a cross-sectioned 
>> image of the plating?
>>
>> Regards,
>>
>> Vladimir
>>
>> ATI Inc.
>> -----Original Message-----
>> From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory
>> Sent: Tuesday, October 17, 2006 10:32 AM
>> To: [log in to unmask]
>> Subject: Re: [TN] ENIG problem
>>
>> Mornin' Inge and Everybody!
>>
>> Got your picture up, it's here:
>> http://stevezeva.homestead.com/files/ENIGpads.jpg
>>
>> Again another remarkable picture. Just curious about what is at the
> top
>> near the center and also on the right-hand edge? Looks like
> something
>> poking up and growing through the plating...what is that?
>>
>> -Steve Gregory-
>>
>> -----Original Message-----
>> From: TechNet [mailto:[log in to unmask]] On Behalf Of Ingemar
> Hernefjord
>> (KC/EMW)
>> Sent: Tuesday, October 17, 2006 9:05 AM
>> To: [log in to unmask]
>> Subject: [TN] ENIG problem
>>
>>
>> Hi amigos,
>> I should never said that we had no ENIG problems. Now we seem to
> have
>> one. Chinese board supplier. Problems with heavy wire aluminum
> bonding
>> on the ENIG pads. Too low pull test values. Possible reason: pad
> surface
>> invaded by copper particles after the bake/reflow/mounting. Sending 
>> picture to Mr Yoda. Never seen this before. Gold is too thick for
> being
>> ENIG (>1um), Nickel about 6um. Can't see how Copper could diffuse to
> the
>> surface so rapidly and at those low temperatures which are typical
> for a
>> general assembly process. Any clue? Graham? You seem to be sitting
> at
>> the keyboard just now.
>> Ingemar Hernefjord
>> SAAB MICROWAVE SYSTEMS
>>
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