Wattachallenge!
Crowds? Hmmm....puter says TN got about 900 members, but where are all? In
reality, the 'crowd' seems to be maximum a handful or two. Yoda's little
tribe, so as to say. The Yodaneers....he-he
Inge
----- Original Message -----
From: "John Burke" <[log in to unmask]>
To: "'TechNet E-Mail Forum'" <[log in to unmask]>; "'Inge'"
<[log in to unmask]>
Sent: Tuesday, October 17, 2006 8:02 PM
Subject: RE: [TN] ENIG problem
> And I hear the crowds shouting:
>
> "If anyone can section that Inge can".......................8-)
>
> Kind regards,
>
> John
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge
> Sent: Monday, October 16, 2006 10:55 AM
> To: [log in to unmask]
> Subject: Re: [TN] ENIG problem
>
> We will try to make a cross section. Maybe hard, because the particles are
> VERY small.
> Inge
>
> ----- Original Message -----
> From: "Vladimir Igoshev" <[log in to unmask]>
> To: <[log in to unmask]>
> Sent: Tuesday, October 17, 2006 4:39 PM
> Subject: Re: [TN] ENIG problem
>
>
> Hi Inge,
>
> The surface looks awfully contaminated. Did you refer to those "grayish"
> spot as "copper particles"? Do you happen to have a cross-sectioned
> image of the plating?
>
> Regards,
>
> Vladimir
>
> ATI Inc.
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory
> Sent: Tuesday, October 17, 2006 10:32 AM
> To: [log in to unmask]
> Subject: Re: [TN] ENIG problem
>
> Mornin' Inge and Everybody!
>
> Got your picture up, it's here:
> http://stevezeva.homestead.com/files/ENIGpads.jpg
>
> Again another remarkable picture. Just curious about what is at the top
> near the center and also on the right-hand edge? Looks like something
> poking up and growing through the plating...what is that?
>
> -Steve Gregory-
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Ingemar Hernefjord
> (KC/EMW)
> Sent: Tuesday, October 17, 2006 9:05 AM
> To: [log in to unmask]
> Subject: [TN] ENIG problem
>
>
> Hi amigos,
> I should never said that we had no ENIG problems. Now we seem to have
> one. Chinese board supplier. Problems with heavy wire aluminum bonding
> on the ENIG pads. Too low pull test values. Possible reason: pad surface
> invaded by copper particles after the bake/reflow/mounting. Sending
> picture to Mr Yoda. Never seen this before. Gold is too thick for being
> ENIG (>1um), Nickel about 6um. Can't see how Copper could diffuse to the
> surface so rapidly and at those low temperatures which are typical for a
> general assembly process. Any clue? Graham? You seem to be sitting at
> the keyboard just now.
> Ingemar Hernefjord
> SAAB MICROWAVE SYSTEMS
>
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