Why?

Inge

----- Original Message -----
From: "Jeffrey Bush" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, October 17, 2006 5:20 PM
Subject: Re: [TN] ENIG problem


Looks like they did a gold flash.

Jeffrey Bush
Director, Quality Assurance and Technical Support
VERMONT CIRCUITS INCORPORATED
           76 Technology Drive - POB 1890
              Brattleboro, Vermont 05302
                Voice - 802.257.4571 ext 21
                    Fax - 802.257.0011
                       <http://www.vtcircuits.com/>


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ingemar Hernefjord
(KC/EMW)
Sent: Tuesday, October 17, 2006 10:05 AM
To: [log in to unmask]
Subject: [TN] ENIG problem


Hi amigos,
I should never said that we had no ENIG problems. Now we seem to have
one. Chinese board supplier. Problems with heavy wire aluminum bonding
on the ENIG pads. Too low pull test values. Possible reason: pad surface
invaded by copper particles after the bake/reflow/mounting. Sending
picture to Mr Yoda. Never seen this before. Gold is too thick for being
ENIG (>1um), Nickel about 6um. Can't see how Copper could diffuse to the
surface so rapidly and at those low temperatures which are typical for a
general assembly process. Any clue? Graham? You seem to be sitting at
the keyboard just now.
Ingemar Hernefjord
SAAB MICROWAVE SYSTEMS

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