(Steve, will examine your mystery picture later.)

Yes, pull values insufficient. As low as 25 grams. The presented area is a
non bonded area, in fact the ENIG looks this way nearly all over the board.
Some pads are OK, others worse than the one on the wall.

127um, undoped wire.

No, don't think those objects are intermetallics.

The pulled area looks quite normal, that's what twists my brain. I'll fix
SEM images on that too for you.

No, nothing changed in the process. We have made about 2 million boards in
this line before this ocurred.

Could be a thin contamination, because the 'blackish' objects you see on the
SEM image are only visible at EHT 1-5 kV.

Thanks for your engagement, even if it's not a Friday question, but real
disaster.

Inge

----- Original Message -----
From: "Creswick, Steven" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, October 17, 2006 4:49 PM
Subject: Re: [TN] ENIG problem


Ingemar,

Wow!  Can't bond with heavy aluminum?  Stuff must be really bad!  Actually,
it appears as though you are able to bond, just don't like the pull values -
correct?  Is the area depicted a region which was bonded?

Are you using 127µm or 254µm wire?  If the image depicts an area that was
bonded, it certainly does not appear to show evidence of adhesion.  Are the
areas that Yoda speaks of regions of intermetallic formation, or something
else?  What does the pulled bond [residual on the board] look like?

We assume that part clamping has not changed, etc.

Just imagine how much fun someone would have with 25µm wire!!!!

Thin coating of flux or organics on the board??

Steve - not Yoda

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ingemar Hernefjord
(KC/EMW)
Sent: Tuesday, October 17, 2006 10:05 AM
To: [log in to unmask]
Subject: [TN] ENIG problem


Hi amigos,
I should never said that we had no ENIG problems. Now we seem to have
one. Chinese board supplier. Problems with heavy wire aluminum bonding
on the ENIG pads. Too low pull test values. Possible reason: pad surface
invaded by copper particles after the bake/reflow/mounting. Sending
picture to Mr Yoda. Never seen this before. Gold is too thick for being
ENIG (>1um), Nickel about 6um. Can't see how Copper could diffuse to the
surface so rapidly and at those low temperatures which are typical for a
general assembly process. Any clue? Graham? You seem to be sitting at
the keyboard just now.
Ingemar Hernefjord
SAAB MICROWAVE SYSTEMS



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