Ingemar,

One thing attracted my attention when I read your posting. You  stated that
the gold was very thick (>1um)

As a supplier of ENIG Chemicals and the chairman of the plating committee
that specified ENIG as surface finish, I can tell you that the process is not
capable of depositing that thickness of gold on nickel.

The only time this gold thickness may be encountered is when the nickel
plating skips the pad (does not or fails to plate) and the gold is deposited
directly on a copper pad.

Verify the Ni thickness on that specific pad that had the very high gold
deposit thickness. this may give us a clue as to what is behind the  failure.

Regards
George Milad
George Milad
National Accounts  Manager for Technology
Uyemura International Corp (UIC)
249 Town Line Rd
Southington CT 06489
[log in to unmask]
Cell: (516) 901  3874

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