Mornin' Inge and Everybody!

Got your picture up, it's here:
http://stevezeva.homestead.com/files/ENIGpads.jpg

Again another remarkable picture. Just curious about what is at the top
near the center and also on the right-hand edge? Looks like something
poking up and growing through the plating...what is that?

-Steve Gregory-

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ingemar Hernefjord
(KC/EMW)
Sent: Tuesday, October 17, 2006 9:05 AM
To: [log in to unmask]
Subject: [TN] ENIG problem

 
Hi amigos,
I should never said that we had no ENIG problems. Now we seem to have
one. Chinese board supplier. Problems with heavy wire aluminum bonding
on the ENIG pads. Too low pull test values. Possible reason: pad surface
invaded by copper particles after the bake/reflow/mounting. Sending
picture to Mr Yoda. Never seen this before. Gold is too thick for being
ENIG (>1um), Nickel about 6um. Can't see how Copper could diffuse to the
surface so rapidly and at those low temperatures which are typical for a
general assembly process. Any clue? Graham? You seem to be sitting at
the keyboard just now.
Ingemar Hernefjord
SAAB MICROWAVE SYSTEMS

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