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October 2006

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Subject:
ENIG problem
From:
"Ingemar Hernefjord (KC/EMW)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ingemar Hernefjord (KC/EMW)
Date:
Tue, 17 Oct 2006 16:04:50 +0200
Content-Type:
text/plain
Parts/Attachments:
text/plain (24 lines) 
 
Hi amigos,
I should never said that we had no ENIG problems. Now we seem to have
one. Chinese board supplier. Problems with heavy wire aluminum bonding
on the ENIG pads. Too low pull test values. Possible reason: pad surface
invaded by copper particles after the bake/reflow/mounting. Sending
picture to Mr Yoda. Never seen this before. Gold is too thick for being
ENIG (>1um), Nickel about 6um. Can't see how Copper could diffuse to the
surface so rapidly and at those low temperatures which are typical for a
general assembly process. Any clue? Graham? You seem to be sitting at
the keyboard just now.
Ingemar Hernefjord
SAAB MICROWAVE SYSTEMS

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