Dave

You may want to read my paper in PC Design and Fabrication (I believe it's
the August issue) on this very subject. As I pointed out, there are scale
factors that must be maintained for a meaningful test.


Best regards

Lee

J. Lee Parker, Ph.D.
JLP Consultants LLC
804 779 3389



----- Original Message -----
From: "Dave Seymour" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Monday, October 02, 2006 5:56 PM
Subject: [TN] laminate Qualification


> Our company has been making a Non RoHS
> assembly for a couple of years. Now the requirement
> is to have a  RoHS compliant assembly.
>
> Current board is
> 18 layers - .072 thick ( lots of .002 and .003 cores)
> 6"x9"
> 4mil line, 4 mil space.
> 15,000 via holes, non conductive filler.
>
> I talked to our fabricator and they recommend
> laminate X.
>
> The spec sheet from Manufacturer of Laminate X calls
> out Tg at 210 C, and Td is 365 C. Based on the sheet
> I would have thought the laminate would have survived
> the reflow cycle.
>
> Unpopulated, laminate X delaminated during
> the reflow cycle at our Contract Manf site.
> The Reflow  cycle looks ok to me.
>
>
> Is there a IPC test method for delamination?
>
> How many heat cycles should the board go through
> for a Class 2 product?
>
> Is there a qualified test lab that could do such testing?
>
>
> Thanks in advance.
>
> Dave
>
> --
> Dave Seymour, CID+
> Catapult Communications Inc.
> 800 Perimeter Park Dr, Suite A
> Morrisville, NC 27560
>
> Direct: (919)653-4249
> Main: (919)653-4180
> Fax: (919)653-4297
>
> [log in to unmask]
>
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