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October 2006

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Subject:
From:
Ted Tontis <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ted Tontis <[log in to unmask]>
Date:
Mon, 16 Oct 2006 09:40:10 -0500
Content-Type:
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        There are some XRF units that can measure the different
thickness of metal platting. I have not used one to verify platting
thickness of a questionable PCB, but watched the feature demoed during a
sales pitch. It was pretty accurate in determining the plating thickness
of the gold but became less accurate as you penetrated the different
platting layers. 
        I don't think a solder test will do you any good, the pad may
wet just fine but cause reliability issues in the field. What class
assembly is this? Is it a high runner that may require a large recall if
something were to go south? 
        I would have so sort of testing done just to make sure
everything is as it should be. 

Good Luck,

Ted T

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