Hi Dave,
Unfortunately, this is not the first time we have been hearing about this 
kind of experience. Manufacturers' spec sheets cannot always be trusted—both in 
terms of the properties given and in terms of claims made.
Also unfortunately, you do not give us any reflow/simulation details. Also, 
the values you quote, Tg=210 C, Td=365 C, appear incredibly high. I certainly 
have not seen anything like it as yet.
1) what was the maximum T the PCB reached? where measured?
2) for how long and at what T was the PCB baked prior to reflow?
3) what is the claimed thermal expansion?
By separate e-mail, I am sending you information on a White Paper I have 
written for specifying PCBs for the Lead-Free soldering temperatures.

Werner

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