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October 2006

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Subject:
From:
Wayne Thayer <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Wayne Thayer <[log in to unmask]>
Date:
Wed, 11 Oct 2006 08:34:29 -0400
Content-Type:
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text/plain (141 lines)
Jim-

The depressing aspect of your problem is the word "reel".  There is no
way to effectively bake them out while still on the reel without taking
literally months.  There are reel service houses who will de-reel, bake,
and re-reel for you.  Last I checked that is about $100 for each reel.
Also, bakeout may reduce solderability due to oxide growth unless its
done inertly.

The old test to see if a package needed to be baked out was to grab a
handful of them and toss them into a solder pot (while wearing
appropriate personal protective equipment, of course!).  This test was
called the "popcorn" test, and was appropriate for wave soldered SMT.
If some of the packages "popped", then they need bakeout.  Pretty crude,
but it was actually used for awhile.  More scientifically, you could try
and find a "maximum moisture level" for the package and then measure the
moisture level by baking some parts and compare weights before and
after.  The accuracy of your scale will determine how many parts you
will need to bake to get a sufficiently accurate wt% moisture.

Wayne Thayer

>>> [log in to unmask] 10/11/2006 8:21 am >>>
Jim,
Per J-STD-033 and J-STD-020, the package of components must be clearly
marked with the component's MSD level, and should be handled as such.
Tell the chip manufacturer to get with the program.

And bake the parts.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Tempea, Ioan
Sent: Wednesday, October 11, 2006 7:17 AM
To: [log in to unmask]
Subject: Re: [TN] Are TSSOP-8 packages moisture sensitive

Jim,

all plastic packages are MSDs. You have to contact the manufacturer to
have the specifics, or, if you are lucky you are going to see the MSD
level on the bags when you get the part.

Good luck,

Ioan

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of West, Jim
Sent: Tuesday, October 10, 2006 4:24 PM
To: [log in to unmask]
Subject: [TN] Are TSSOP-8 packages moisture sensitive


Are TSSOP-8 packages susceptible to moisture?  We have a chip
manufacture offering a reel of a TSSOP component that has been on
their
shelf since late '04'.  The component is a N-Channel MOSFET.  By the
time we receive them, it will be late this year, should I bake them
when
we get ready to use to be safe?

Thanks,



Jim West
Engineering Manager
Nexergy Inc.
www.nexergy.com
tel: (614) 351-6216
fax: (614) 324-1979



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