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October 2006

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Subject:
From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:
Wed, 11 Oct 2006 07:21:32 -0500
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Jim,
Per J-STD-033 and J-STD-020, the package of components must be clearly
marked with the component's MSD level, and should be handled as such.
Tell the chip manufacturer to get with the program.

And bake the parts. 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Tempea, Ioan
Sent: Wednesday, October 11, 2006 7:17 AM
To: [log in to unmask]
Subject: Re: [TN] Are TSSOP-8 packages moisture sensitive

Jim,

all plastic packages are MSDs. You have to contact the manufacturer to
have the specifics, or, if you are lucky you are going to see the MSD
level on the bags when you get the part.

Good luck,

Ioan

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of West, Jim
Sent: Tuesday, October 10, 2006 4:24 PM
To: [log in to unmask]
Subject: [TN] Are TSSOP-8 packages moisture sensitive


Are TSSOP-8 packages susceptible to moisture?  We have a chip
manufacture offering a reel of a TSSOP component that has been on their
shelf since late '04'.  The component is a N-Channel MOSFET.  By the
time we receive them, it will be late this year, should I bake them when
we get ready to use to be safe?  
 
Thanks,
 


Jim West
Engineering Manager
Nexergy Inc.
www.nexergy.com
tel: (614) 351-6216
fax: (614) 324-1979



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