Good afternoon everyone!

I am seeking the assistance/guidance of anyone who has had practical
experience with placing, soldering, and rework of this particular
component.  One of our customers is looking to use this component on
quite a few upcoming designs and I am trying to gather information from
a contract manufacturer's perspective on what issues and/or concerns
there have been when using this lead-less style component.

A few questions initially are:

1.)     Recommended stencil thickness for this component.  (What has
worked the best in practical application)
2.)     Placement concerns or suggestions. (In addition to the multiple
I/O pins there is a center ground and VPWR pad to consider)
3.)     Inspection guidelines (x-ray)
4.)     Rework guidelines (tools and equipment that has worked best)

If there is anyone who is familiar with this particular component and
would be willing to share there experience with me I would really
appreciate.

Thanks in advance for any help.

Best regards,

Rich Lasko


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