Bob,

Lot's of things to try here..

- Try baking both the PCB and the component prior to soldering.  You need to
check the temperature limitations of your other components and also the
transformer (plastic bobbin?) for the appropriate temperature to bake at.
Common temp to pre-bake is in the 200 to 250F range.

- You can also heat from the top side while soldering with a heat bath.
Check a company called Zephyrtronics.  They make temperature controlled heat
baths.

- You did not state is what your iron temperature is, but you may be able to
increase that temperature?

- Review the iron tip size.  Is the tip sized properly to maximize your heat
flow?  Use the widest tip possible to cover but not exceed the contact area,
and a shorter tip recovers faster (shorter heat path).

- You can also increase the wattage of the soldering iron.  80-85W should
work for most ground planes if substrates are preheated..

Lastly, this is an obvious one, make sure there is good solderability of the
component and PCB....

Good luck.


Kevin Glidden
Manufacturing Engineer
Astronics Luminescent Systems Inc.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bob Arciolla
Sent: Tuesday, October 10, 2006 1:44 PM
To: [log in to unmask]
Subject: [TN] vertical fill problem

Good afternoon,

I have a situation where I have a transformer that I am populating in a pcb
and I have a ground plane right up next to it and between the ground plane
and the core of the transformer, I cannot meet the IPC requirement of 75%
vertical fill on the tranformer leads. Any suggestions?
Thanks in advance,
Bob Arciolla
Endicott Research Group
Quality/Safety Manager
607  754-9187 ex 3034
607  754-9255   fax

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