Hi Bob,

Lot's of pre-heat, and pre-baking in an oven just immeadiately prior to
wave helps a lot with big, heavy, high thermal mass boards.

But if it's a class 2 assembly, the J-STD gives you an out under 6.3.2:

"As an exception to the Class 2 fill requirements in Table 6-5, for
plated through holes connected to thermal or conductor planes that act
as thermal heat sinks, a 50% vertical fill of solder is permitted, but
with solder extending 360-degrees around the lead with 100% wetting from
the barrel wall to lead on the secondary side, and surrounding PTH's
meeting requirements of Table 6-5."

-Steve Gregory- 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bob Arciolla
Sent: Tuesday, October 10, 2006 12:44 PM
To: [log in to unmask]
Subject: [TN] vertical fill problem

Good afternoon,

I have a situation where I have a transformer that I am populating in a
pcb and I have a ground plane right up next to it and between the ground
plane and the core of the transformer, I cannot meet the IPC requirement
of 75% vertical fill on the tranformer leads. Any suggestions?
Thanks in advance,
Bob Arciolla
Endicott Research Group
Quality/Safety Manager
607  754-9187 ex 3034
607  754-9255   fax

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