IPC/JEDEC International Conference on Lead Free Electronic Components
and Assemblies "RoHS Compliance and Beyond," is being held at the
Intercontinental Frankfurt, Frankfurt, Germany, October 30 - November 1,
2006.

In an effort to help the industry continue its quest for knowledge and
understanding with regard to critical lead free issues, the following
topics will be addressed: new alloys and materials evaluations,
inspection changes, tin whiskers, lead free on advanced packages like
chip scale, and flip chip reliability. Assembly operations will face
increased assembly costs, perhaps 15% higher, and will be impacted in
areas beyond manufacturing such as field support, sales, marketing and
training.  This conference will bring together top experts from around
the world with the most up-to-date information for what will be a truly
international event.  Please note that sleeping room space at the hotel
is limited, make your travel arrangements as soon as possible.

For a conference brochure or to register, please place the following
link into your browser: www.ipc.org/LFFrankfurt.

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