Netters,
We recently started to use reflow under nitrogen on OSP coated boards.
These boards were previously immersion silver plated and we reflowed them in air. Very few tombstoning was seen.
Our customer decided to change the finish and requires mandatory reflow under nitrogen.
We are completing all the soldering operations within 2 days. We use no clean solder paste and no clean flux.
Questions:
1. Did anybody experience increase of tombstoning of 0402 passives when using nitrogen?
2. Is using nitrogen during reflow  beneficial for the next process- selective wave soldering under nitrogen?
3. For thick multilayer boards with more than 20 layers, can complete hole fill be expected during wave soldering of OSP boards after double reflow?
If you had any similar experience, could you tell me how you solved these problems?
Thank you,
Gaby

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------