Dear All:
 
These are Batch 13 terms . Please review them and give your opinions.  
 
Montreal Protocol                             蒙特利尔协议  76.1758

An agreement by industrialized nations, at a meeting held in Montreal, Canada, to eliminate chlorofluorocarbons from all processes by 1995. 

1995年在加拿大蒙特利尔举行的旨在消除所有加工中的氯氟化碳的工业国会议中达成的协议。

 

Mother Board                                    主板                 85.0778

A printed board assembly that is used for interconnecting arrays of plug-in electronic modules. (See also "Backplane.")

用以连接内插电子模块的印制板组件。(参见“底板”)

 

Mounting Hole                                  装配孔             20.0779

A hole that is used for the mechanical support of a printed board or for the mechanical attachment of components to a printed board.

一种孔用作于印制板的机械支撑或印制板上元件的机械附件。

 

Mounting Tack Time                         贴片时间         73.1927

The interval of time required for mounting one component or all components on one printed board.

贴装一个或全部元器件到一块印制板上的时间。

 

Muffle                                                 消音器             75.0780

An enclosure with a rectangular or oval cross-section that is located between the heating elements and the parts being processed that contains the atmosphere required for the reflow soldering process.

一个矩形或椭圆形的封装体，处于加热单元和回流焊过程规定的气体中的部件之间。

 

Multi-Vari                                           多变异             91.0781

A nonmathematical method for determining the sources of variation. 

一种确定变异源的非数学方法。

 

 

Multichip Module                              (MCM) 多芯片模块 (MCM)       86.0784

A microchip module consisting primarily of closely-spaced integrated circuit dice that have a silicon area density of 30% or more.

主要由相近的硅片密度不少于30％的集成电路块组成的微芯片模块。

 

Multichip Module-Ceramic (MCM-C) 陶瓷多芯片模块 (MCM-C)     86.1928

Multichip module primarily using hybrid processing technology where materials of the mounting structure are ceramic or glass-ceramic alternatives. 材质为陶瓷或玻璃陶瓷使用混合处理技术的多芯片模块。

 

 

Thank you!

 
IPC TG2-30CN Secretary：Charlotte