Dear All:
 
These are Batch 12 terms . Please review them and give your opinions.  
 
Mixed Technology                            混合技术         70.1757

In surface mounting, refers to mixing through hole component and surface mounting components on the same side of a printed circuit board. 

在表面贴装中，对印制板同一面复合使用通孔和表面贴装元件的技术。

 

Modal Form (对话框)                        模式排列         25.0773

The technique whereby a data description or other pertinent command is given only once at the beginning of a related set of data.

数据描述或其他相关数据簇起始时提供的相关指令技术

 

Modification                                      修正                 77.0774

The revision of the functional capability of a product in order to satisfy new acceptance criteria. 

修改产品功能性能力来满足新的接收标准。

 

Module                                               模块                 80.0775

A separable unit in a packaging scheme. 封装体系中的可分离单元。

 

Module Board                                   模块板             67.1922

A substrate on which bare die and surface-mount components are attached and interconnected intended to be further assembled to a product planar board.

一块预先组装了模具和表面贴装元件的基板，为进一步组装成品板作准备。

 

Moisture Absorption                        吸潮量             40.1923

Under specified test conditions, the weight percentage of moisture absorbed by a material. 

特定测试条件下，物质吸收的潮湿比重

 

Moisture Barrier Bag (MBB)            防潮袋             30.1924

A bag that is electrostatic discharge (ESD) safe and is designed to restrict the ingress of water vapor used to package moisture-sensitive devices. 

用来包装潮湿敏感元器件的防静电且防止水蒸气侵入的袋子。

 

Moisture Resistance                        防潮力             40.1925

The measure of how well the insulation characteristics of a material are maintained when exposed to temperature and humidity.

物质暴露在温湿度环境下维持原有特性能力的测量。

 

Molded Interconnection Device     铸型互联器件  67.1926

A combination of molded plastic substrate and conductive patterns that provide both the mechanical and electrical functions of an electronic interconnection package. 铸型塑料基材和用来提供电子互联组件机械及电子功能的导电图层的组合。

 

Molecular Dye-Imaging Material     分子染色材料  24.0776

See "Diazo Material." 参见“重氮基材料”

 

Monolithic Integrated Circuit          单片式集成电路 30.0777

An integrated circuit in the form of a monolithic structure. 

以单块集成电路为形式的集成电路。

 

 

  

 

 

Thank you!

 
IPC TG2-30CN Secretary：Charlotte