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Date: | Mon, 23 Oct 2006 20:27:15 -0500 |
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Dear All:
Thhese the first ten terms today. Please review them and give your opinions.
Lip Height 唇缘高度 51.0712
The perpendicular distance from one primary cutting edge to another.
一个主切面到另一个的垂直高度。
Liquidous, Solder 液相线,焊料 75.1906
The temperature at which a solder alloy is completely melted.
焊料合金完全熔化的温度点。
Load Capacitance 负载电容 21.0713
The capacitance seen by the output of a logic circuit or other signal source.
与逻辑电路或其他信号源输出适配的电容。
Load Time 载入时间 92.0714
The time it takes to load a unit in an inspection/test machine and to perform any necessary programming or machine alignment.
检验或测试仪器装载测试单元,任何编程或机器调整所需的时间。
Loading Direction 装载方向 70.1907
The direction of board passing through an assembly line viewed from the operator side.
以操作工为观察点的电路板通过装配线方向。
Local Fiducial 局部基准点 20.0715
A fiducial mark (or marks) used to locate the position of a land pattern for an individual component on a printed board.
用于定位印制板上个体元件焊盘位置的基准点(或标记)。
Local Intelligence 局部智能 25.0716
The capability of a work station to independently process data without the use of a host or central processing unit.
工作站脱离主机或中央处理单元情况下独立处理数据的能力。
Local Reflow Soldering 局部再流焊 75.1908
The process of reflow soldering using the heat that is directly supplied to the local area to be reflowed by an energy beam (laser), soldering iron or hot air reflow tool.
通过能量光束(激光)、电烙铁或热风再流焊接工具,将热量直接施加于局部区域,从而实现局部焊接的再流焊工艺。
Locating Accuracy (Component) 定位精度(元件)73.1909
The accuracy in positioning of a component described by the amount of displacement from the desired position.
由准确贴装元件于目标位置的数量所描述的精准度。
Locating Edge 边缘定位 20.0028
A tooling feature in the form of the edge of a printed board.
以印制板边缘为形式的加工
Thank you!
IPC TG2-30CN Secretary:Charlotte
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