Hi,


1.一种其外部连接由元件封装四周及底部的引脚构成的表面贴装元件(见图L-3)。


建議：一种由封裝于元四周及底部的引脚與外部連接的表面贴装元件(见图L-3)。


2. 一种其外部连接由元件本体的组成部分——金属端子构成的芯片载体。（参见“有引脚芯片载体”）


建議：一種由同屬元件本體的金屬端子與外部連接的芯片載體


Luoisa Qi


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-----Original Message-----


From: TGAsia [mailto:[log in to unmask]] On Behalf Of Charlotte Hao


Sent: 2006年10月19日 19:03


To: [log in to unmask]


Subject: [TGA] Please review four terms of IPC-T-50





Dear All,


 


I am sending you four terms of IPC-T-50 translated. I look forward to get the opinions about them from you. 


 


I want to send you four terms every 3 days, how do you think about it? Please your opinion frankly.


 


Thank you very much. 


 


They are listed below. 


 


 


 


1. Leaded Surface-Mount Component                      有引脚表面贴装元件           33.1435





A surface-mount component for which external connections consist of leads that are around and down the side of the package. (See Figure L-3.) (See also "Leadless Surface-Mount Component.")





一种其外部连接由元件封装四周及底部的引脚构成的表面贴装元件(见图L-3)。(参见“无引脚表面贴装元件”)





                                                                                





2. Leadless Chip Carrier                                          无引脚芯片载体                    33.1436  





A chip carrier whose external connections consist of metallized terminations that are an integral part of the component body. (See also "Leaded Chip Carrier.")





一种其外部连接由元件本体的组成部分——金属端子构成的芯片载体。（参见“有引脚芯片载体”）





                                                     





3. Leadless Component                                           无引脚元件                             30.1754





See "Leadless Surface Mount Components." 





参见“无引脚表面贴装元件”   





 





4. Leadless Device                                                   无引脚器件                             33.0694





See "Die and Leadless Surface Mount Component." 





参见“晶片和无铅表面贴装元件”





 





 





B/R





 





Charlotte





 





 





 





 





 


 


 





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