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Date: | Fri, 20 Oct 2006 09:01:23 +0800 |
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Hi,
1.一种其外部连接由元件封装四周及底部的引脚构成的表面贴装元件(见图L-3)。
建議:一种由封裝于元四周及底部的引脚與外部連接的表面贴装元件(见图L-3)。
2. 一种其外部连接由元件本体的组成部分——金属端子构成的芯片载体。(参见“有引脚芯片载体”)
建議:一種由同屬元件本體的金屬端子與外部連接的芯片載體
Luoisa Qi
HR/T&D
Flextronics Doumen Industrial Park
Xin Qing Science & Technology Park
Jing An, Doumen, Zhuhai, P. R. China, 519180
Mobile: +86 13527269496
Ext 7883-6306
Fax: + 86 756 5555189
Email: [log in to unmask]
-----Original Message-----
From: TGAsia [mailto:[log in to unmask]] On Behalf Of Charlotte Hao
Sent: 2006年10月19日 19:03
To: [log in to unmask]
Subject: [TGA] Please review four terms of IPC-T-50
Dear All,
I am sending you four terms of IPC-T-50 translated. I look forward to get the opinions about them from you.
I want to send you four terms every 3 days, how do you think about it? Please your opinion frankly.
Thank you very much.
They are listed below.
1. Leaded Surface-Mount Component 有引脚表面贴装元件 33.1435
A surface-mount component for which external connections consist of leads that are around and down the side of the package. (See Figure L-3.) (See also "Leadless Surface-Mount Component.")
一种其外部连接由元件封装四周及底部的引脚构成的表面贴装元件(见图L-3)。(参见“无引脚表面贴装元件”)
2. Leadless Chip Carrier 无引脚芯片载体 33.1436
A chip carrier whose external connections consist of metallized terminations that are an integral part of the component body. (See also "Leaded Chip Carrier.")
一种其外部连接由元件本体的组成部分——金属端子构成的芯片载体。(参见“有引脚芯片载体”)
3. Leadless Component 无引脚元件 30.1754
See "Leadless Surface Mount Components."
参见“无引脚表面贴装元件”
4. Leadless Device 无引脚器件 33.0694
See "Die and Leadless Surface Mount Component."
参见“晶片和无铅表面贴装元件”
B/R
Charlotte
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