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Date: | Fri, 20 Oct 2006 08:08:16 +0800 |
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可以。
Charlotte Hao
<CharlotteHao@IPC 收件人: [log in to unmask]
.ORG> 抄送:
发件人: TGAsia 主题: [TGA] Please review four terms of IPC-T-50
<[log in to unmask]>
2006-10-19 19:03
请答复 给 Asia
Committe Task
Group Forum; 请答
复 给 Charlotte
Hao
Dear All,
I am sending you four terms of IPC-T-50 translated. I look forward to get
the opinions about them from you.
I want to send you four terms every 3 days, how do you think about it?
Please your opinion frankly.
Thank you very much.
They are listed below.
1. Leaded Surface-Mount Component 有引脚表面贴装元件
33.1435
A surface-mount component for which external connections consist of leads
that are around and down the side of the package. (See Figure L-3.) (See
also "Leadless Surface-Mount Component.")
一种其外部连接由元件封装四周及底部的引脚构成的表面贴装元件(见图L-3)。(参见
“无引脚表面贴装元件”)
2. Leadless Chip Carrier 无引脚芯
片载体 33.1436
A chip carrier whose external connections consist of metallized
terminations that are an integral part of the component body. (See also
"Leaded Chip Carrier.")
一种其外部连接由元件本体的组成部分——金属端子构成的芯片载体。(参见“有引脚芯
片载体”)
3. Leadless Component 无引脚元件
30.1754
See "Leadless Surface Mount Components."
参见“无引脚表面贴装元件”
4. Leadless Device 无引脚
器件 33.0694
See "Die and Leadless Surface Mount Component."
参见“晶片和无铅表面贴装元件”
B/R
Charlotte
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