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Reply To: | (Leadfree Electronics Assembly Forum) |
Date: | Fri, 6 Oct 2006 10:46:26 -0500 |
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Design for Excellence/Exploring the Challenges
December 7, 2006
IPC Headquarters, Bannockburn, IL
This workshop will allow attendees to explore the major issues related
to designing printed boards and printed board assemblies that are used
in electronic equipment. Standardization has become a key factor in
relating those capabilities that are available in the industry
infrastructure. Thus, A detailed discussion will take place on all the
characteristics what must be considered to make a design manufacturable.
The subjects covered, explore the meaning of Design for Excellence.
Included in the material that will be presented are the electronic
product features, the environment in which it must operate, the material
properties, the assembly sequences, and the verification methods used to
ensure high quality and reliability. Here is everyone's chance to "kick
the tires" and discover the cost effective techniques for producing
designs that meet customer expectations.
For more information on this workshop, please place the following text
into your browser:
http://www.ipc.org/calendar/2006/Design_For_Excellence_12_07_06/Design_E
xcellence_12_07_06.htm.
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