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October 2006

Leadfree@IPC.ORG

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Subject:
From:
John Burke <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Fri, 27 Oct 2006 13:26:12 -0500
Content-Type:
text/plain
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text/plain (55 lines)
ER,

Solder it with tin/lead?

Only joking,

Are you using a high speed laminate? Polyimide?

John
> ----- Original Message -----
> From: "DeGenova, Jon R." <[log in to unmask]>
> To: [log in to unmask]
> Subject: [LF] Lead free parts falling off boards
> Date:         Fri, 27 Oct 2006 14:19:01 -0400
> 
> 
> We have some PCB assemblies, measuring approximately 11x13 inches in
> size, .062" thick, with very dense population on both sides.  They are
> mostly SMT, including about 3 BGAs.  These ran fine on as leaded boards,
> but in our first runs using a lead-free process and an ENIG board finish
> we're seeing a strange problem.  Reports are that parts are 'falling
> off', not in large numbers, but enough to raise an eyebrow.  Mostly
> these are passives that are coming off after a double reflow process
> (there was no wave soldering done on the boards at the point that this
> was noticed).  And in some cases, the entire PAD was coming up off the
> circuit board.  Has anyone seen similar issues? I'd like to give our
> assembly personnel some advice on where to start investigating.
> 
> Thanks,
> Jon DeGenova
> 
> 
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Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
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