Subject: | |
From: | |
Reply To: | (Leadfree Electronics Assembly Forum) |
Date: | Fri, 27 Oct 2006 13:26:12 -0500 |
Content-Type: | text/plain |
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ER,
Solder it with tin/lead?
Only joking,
Are you using a high speed laminate? Polyimide?
John
> ----- Original Message -----
> From: "DeGenova, Jon R." <[log in to unmask]>
> To: [log in to unmask]
> Subject: [LF] Lead free parts falling off boards
> Date: Fri, 27 Oct 2006 14:19:01 -0400
>
>
> We have some PCB assemblies, measuring approximately 11x13 inches in
> size, .062" thick, with very dense population on both sides. They are
> mostly SMT, including about 3 BGAs. These ran fine on as leaded boards,
> but in our first runs using a lead-free process and an ENIG board finish
> we're seeing a strange problem. Reports are that parts are 'falling
> off', not in large numbers, but enough to raise an eyebrow. Mostly
> these are passives that are coming off after a double reflow process
> (there was no wave soldering done on the boards at the point that this
> was noticed). And in some cases, the entire PAD was coming up off the
> circuit board. Has anyone seen similar issues? I'd like to give our
> assembly personnel some advice on where to start investigating.
>
> Thanks,
> Jon DeGenova
>
>
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Search previous postings at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
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