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Reply To: | (Designers Council Forum) |
Date: | Tue, 24 Oct 2006 11:51:27 -0500 |
Content-Type: | text/plain |
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I am in need of recommendations for solderpaste and thermal profiles for
Thermagon material on a 0.060" aluminum substrate. My concern is that a
typical reflow process will not put enough heat into the aluminum.
The board in question is 1.2" square, and only has one power part that needs
to be soldered on, a 3W LED, with lead pitch of around 2mm.
Thanks in advance,
Mike Howell
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