Hi Steve,

Its 8 layer through hole and also has 12th blind vias both sides (1 to 2, 7
to 8), 5th track/gap over a lot of the area and gold over nickel. The
component area is approx 3.5 x 2.5 ins. With both sides covered with SM
parts at about 20-30% parts to board area.
It's to be used for wire bonding open Si chips for a physics detector.
Its 14.5ins by 2.5ins 1/16th thick.
The board material seems good and the finish is very flat which is what is
required in this instance.
We intend to fix 5in x 2.5in silicon detectors on the board surface hence
the flatness.

The PCB manufacturers had a devil of a job making the boards. In fact they
failed to make the full quantity.
We are now with a new manufacturer who is happy with the design.
The failure may have been due to the material or just the amount of small
tracks and blind vias, only time will tell.
The PCB manufacturers had not used it before with this technology as far as
I know.
I know they had terrible trouble with the blind vias.

We have had 2 boards populated as prototypes for our design.
Unfortunately some of the chips have be placed 180 deg out. I have not yet
seen the finished results.
Seems to be a fated board this one.
Jigs were used to maintain the flatness during the machine soldering
process.

Regards
Jim
----- Original Message -----
From: <[log in to unmask]>
To: "Jim Thornhill" <[log in to unmask]>
Sent: 08 October 2006 12:31
Subject: Re: [DC] High Temp Board Materials


> Hi Jim,
>
> Is this a through hole board or blind via?
>
> Good Luck,
> Steve
>
>
> ----- Original Message -----
> From: "Jim Thornhill" <[log in to unmask]>
> To: <[log in to unmask]>
> Sent: Wednesday, October 04, 2006 11:34 AM
> Subject: Re: [DC] High Temp Board Materials
>
>
>> We are currently using nelco N4000-13-SI and N4000-13 material. It seems
>> a
>> little 'softer' than FR4 but holds its shape well.
>> We have not had any populated boards back yet (next week probably) but
>> the
>> Tg of the material is much higher than FR4 and so I would expect good
>> performance from the lead free build.
>>
>> Regards
>>
>> Jim Thornhill
>> University of Liverpool
>> Department of Physics
>> Oliver Lodge Laboratory
>> Oxford Street
>> Liverpool
>> L69 7ZE
>> ENGLAND
>>
>> These are personal comments not those of the University
>>
>> ----- Original Message -----
>> From: "Mariani, Stephen" <[log in to unmask]>
>> To: <[log in to unmask]>
>> Sent: Wednesday, October 04, 2006 2:28 AM
>> Subject: [DC] High Temp Board Materials
>>
>>
>>>I would like to know what others are using as there standard High Temp
>>> Materials. Our temps are around 245c to 260c.
>>> We are using ISOLA IS620 but hearing that there may be issues with
>>> sequential lam boards. Anyone experiencing this problem? Anyone here
>>> using Nelco N400-12 or N400-13 for profiles around 145c
>>>
>>> Steve
>>>
>>>
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