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October 2006

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Subject:
From:
"Cosentino, Tony" <[log in to unmask]>
Reply To:
(Designers Council Forum)
Date:
Wed, 4 Oct 2006 11:55:14 -0500
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text/plain (92 lines)
Jim,
How big are your boards - thickness, size, layer count? What is the
populated density of these boards? If you can, please supply this
information and the results from your Pb-Free build.
Thanks
Tony Cosentino
Tekelec

-----Original Message-----
From: DesignerCouncil [mailto:[log in to unmask]] On Behalf Of Jim
Thornhill
Sent: Wednesday, October 04, 2006 11:35 AM
To: [log in to unmask]
Subject: Re: [DC] High Temp Board Materials

We are currently using nelco N4000-13-SI and N4000-13 material. It seems
a little 'softer' than FR4 but holds its shape well.
We have not had any populated boards back yet (next week probably) but
the Tg of the material is much higher than FR4 and so I would expect
good performance from the lead free build.

Regards

Jim Thornhill
University of Liverpool
Department of Physics
Oliver Lodge Laboratory
Oxford Street
Liverpool
L69 7ZE
ENGLAND

These are personal comments not those of the University

----- Original Message -----
From: "Mariani, Stephen" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, October 04, 2006 2:28 AM
Subject: [DC] High Temp Board Materials


>I would like to know what others are using as there standard High Temp

>Materials. Our temps are around 245c to 260c.
> We are using ISOLA IS620 but hearing that there may be issues with  
>sequential lam boards. Anyone experiencing this problem? Anyone here  
>using Nelco N400-12 or N400-13 for profiles around 145c
>
> Steve
>
>
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