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October 2006

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Subject:
Re: Backward Compatibility of Tin Electroplating
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Thu, 26 Oct 2006 14:27:02 EDT
Content-Type:
text/plain
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text/plain (20 lines) 
Hi Rich,
For soldering, in stark contrast with welding, the joints are made   by the
dissolution of the the base metal without melting it, by being in intimate
contact with the liquid solder. Thus, all that is required is that the temperature
be slightly above the Liquidus of the solder [183C for eutectic Sn/Pb, 217C
for eutectic SnAg Cu]. Thus, when you are soldering to tin plating, you do not
reach 232C.

Werner

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