Hi Dave,
Forgot to answer some of your Q's.
No, there is no IPC test method for delamination covering this?
The number of reflow/soldering temperature cycles that a PCB should be able
to go through should be at least 5 or 6—and there should be no difference
between Class 2 and Class 3.
I have seen IST testing finding PCB delaminations—so that sounds like a
viable test for this. Of course, subjecting coupons to these soldering environments
wold work also.
Werner
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