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Date: | Mon, 2 Oct 2006 17:56:14 -0400 |
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Our company has been making a Non RoHS
assembly for a couple of years. Now the requirement
is to have a RoHS compliant assembly.
Current board is
18 layers - .072 thick ( lots of .002 and .003 cores)
6"x9"
4mil line, 4 mil space.
15,000 via holes, non conductive filler.
I talked to our fabricator and they recommend
laminate X.
The spec sheet from Manufacturer of Laminate X calls
out Tg at 210 C, and Td is 365 C. Based on the sheet
I would have thought the laminate would have survived
the reflow cycle.
Unpopulated, laminate X delaminated during
the reflow cycle at our Contract Manf site.
The Reflow cycle looks ok to me.
Is there a IPC test method for delamination?
How many heat cycles should the board go through
for a Class 2 product?
Is there a qualified test lab that could do such testing?
Thanks in advance.
Dave
--
Dave Seymour, CID+
Catapult Communications Inc.
800 Perimeter Park Dr, Suite A
Morrisville, NC 27560
Direct: (919)653-4249
Main: (919)653-4180
Fax: (919)653-4297
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