Sender: |
|
X-To: |
|
Date: |
Mon, 2 Oct 2006 18:12:28 EDT |
Reply-To: |
|
Subject: |
|
MIME-Version: |
1.0 |
Content-Transfer-Encoding: |
quoted-printable |
Content-Type: |
text/plain; charset="UTF-8" |
From: |
|
Parts/Attachments: |
|
|
Hi Dave,
Unfortunately, this is not the first time we have been hearing about this
kind of experience. Manufacturers' spec sheets cannot always be trusted—both in
terms of the properties given and in terms of claims made.
Also unfortunately, you do not give us any reflow/simulation details. Also,
the values you quote, Tg=210 C, Td=365 C, appear incredibly high. I certainly
have not seen anything like it as yet.
1) what was the maximum T the PCB reached? where measured?
2) for how long and at what T was the PCB baked prior to reflow?
3) what is the claimed thermal expansion?
By separate e-mail, I am sending you information on a White Paper I have
written for specifying PCBs for the Lead-Free soldering temperatures.
Werner
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
|
|